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HIKMICRO QD610 HFR R&D Thermal Camera

The HIKMICRO QD610 (HM-TD2D67E-7/Q) is a specialized, laboratory-grade thermal imaging camera engineered for high-speed scientific research, dynamic product testing, and fast-moving industrial quality control. Designed to capture ultra-fast thermal events, this dual-mode camera allows engineers to toggle between high-definition structural monitoring and extreme High Frame Rate (HFR) capture.

Like the rest of HIKMICRO’s elite R&D lineup, the QD610 delivers an exceptionally tight laboratory-grade measurement accuracy of ±1°C in the critical 0–150°C testing range. Supported by native Modbus TCP/RS485 connectivity and Alarm I/O, it seamlessly bridges the gap between the R&D testing lab and high-speed automated production lines.

Key Professional Advantages

  • Dual-Mode High Frame Rate (HFR): Engineers can choose between capturing high-definition thermal data (640 × 512 at 50 fps) for spatial clarity, or prioritizing speed by switching to 100 fps (at 384 × 288 resolution). This 100 Hz capture rate is critical for freezing fast-moving thermal transients, dynamic stress tests, and instantaneous electrical failures.

  • Laboratory-Grade Precision: For the critical 0°C to 150°C testing range, the camera guarantees an accuracy of ±1°C / ±1%, providing the exact, reliable data necessary for scientific publication, safety certifications, and R&D validation.

  • Wide-Angle Thermal Intelligence: Equipped with a 7 mm wide-angle lens (90.4° × 75° field of view), it is perfectly optimized for monitoring large test benches, battery arrays, or wide conveyor webs from a short distance.

  • Wide Testing Range: While offering tightened precision for lower temperatures, the sensor remains fully capable of testing high-heat prototypes and industrial processes, supporting a total measurement range of -20°C up to 650°C.

  • Industrial Automation Ready: Despite its scientific focus, the unit supports DC 12-24V power and standard industrial protocols, allowing successful high-speed lab tests to be scaled directly into factory-floor quality assurance nodes.

Technical Specifications Overview

FeatureSpecification
Thermal Resolution & Speed

640 × 512 @ 50 fps


OR


384 × 288 @ 100 fps

Lens System7 mm Wide-Angle (90.4° × 75°)
Measurement Accuracy

±1°C / ±1% (for 0~150°C)


±2°C / ±2% (Standard range)

Temperature Range-20°C to 650°C
Communication ProtocolsModbus TCP, RS485
InterfaceAlarm Input / Alarm Output
Power InputDC 12-24V

Typical Scientific & Industrial Applications

  • High-Speed Automotive Testing: Thermal characterization of rapid mechanical events, such as airbag deployment, brake friction transients, and fast-charging EV battery thermal runaway.

  • Dynamic Electronics Testing: Capturing instantaneous short circuits, rapid heat dissipation, and thermal spikes in power electronics before catastrophic failure occurs.

  • High-Speed Manufacturing: Quality assurance on extremely fast automated conveyor lines where a standard 50 Hz camera would suffer from motion blur.

  • Materials Science: Observing the thermal conductivity and stress-fracture heat signatures of materials subjected to rapid dynamic loading or ballistic testing.

In the Box

  • HIKMICRO QD610 HFR R&D Thermal Camera

  • 7 mm Wide-Angle Lens

  • Lab & Industrial Mounting Hardware

  • Power & Data Interface Connectors

  • Premium Calibration Certificate (Lab Grade)

  • Technical Documentation & Software Guide

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