HIKMICRO R&D Box Thermal Camera

The HIKMICRO R&D Box Thermal Camera (HM-TD2C68E) is an elite, laboratory-grade thermal imaging system designed specifically for product development, electronics testing, and materials science. Unlike standard industrial cameras built for rugged area monitoring, this unit is engineered for absolute precision, offering an incredibly tight measurement accuracy of ±1°C for critical temperature ranges.

Equipped with a high-definition 640 × 512 thermal sensor and a highly specialized dual-mode optical system, it allows engineers to seamlessly switch between standard thermal observation and extreme close-up macro inspection. With a rapid 50 fps refresh rate, it is the ultimate tool for capturing fast thermal transients, heat dissipation, and micro-component failure in real-time.

Key Professional Advantages

• Standard & Macro Dual-Mode Lens: Features a unique manual switch that transitions the 25 mm lens from standard focus to macro focus. This allows you to monitor an entire printed circuit board (PCB) assembly, and then zoom in to analyze the thermal output of a single microscopic microchip.

• Laboratory-Grade Precision: For the critical 0°C to 150°C testing range, the camera tightens its accuracy to an exceptional ±1°C / ±1%, providing the exact, highly reliable data required for scientific publication and R&D validation.

• High-Speed Thermal Dynamics: The 50 fps frame rate ensures that rapid temperature spikes—such as a short circuit or a fast-acting thermal fuse—are captured flawlessly, avoiding the motion blur or missed data points common in slower cameras.

• Wide Testing Range: While highly accurate at lower temperatures, the sensor is fully capable of testing high-heat prototypes, supporting a total measurement range of -20°C up to 650°C.

• Production Line Transition: Despite its R&D focus, the camera retains full industrial connectivity (Modbus TCP/RS485 and Alarm I/O), allowing a successful prototype testing protocol to be instantly ported directly to the factory floor.

Technical Specifications Overview

Typical Scientific & Industrial Applications

• Electronics & PCB Testing: Micro-level thermal characterization of processors, power supplies, and high-density circuit boards during the prototyping phase.

• Automotive & EV Battery R&D: Precise thermal profiling of lithium-ion battery cells during charge/discharge cycles and thermal runaway testing.

• Materials Science: Observing the thermal conductivity, stress testing, and heat dissipation properties of newly engineered alloys or composites.

• Quality Assurance Labs: Post-manufacturing failure analysis and non-destructive testing (NDT) of high-value aerospace or medical components.

In the Box

• HIKMICRO R&D Box Thermal Camera (HM-TD2C68E)

• 25 mm Dual-Mode (Standard/Macro) Lens

• Lab & Industrial Mounting Hardware

• Power & Data Interface Connectors

• Premium Calibration Certificate (Lab Grade)

• Technical Documentation & Software Guide